Review by Four Academicians | The Scientific and Technological Achievements of Cedar’s “Key Technology and Industrialization of Super High Density Flip Chip LED Integrated Encapsulation UHD Display” Evaluated to be Internationally advanced, with Core Technology Reaching International Leading Level
On March 4, the achievement of the “Key Technology and Industrialization of Super High Density Flip Chip LED Integrated Encapsulation UHD Display” of Changchun Cedar Electronics Technology Co., Ltd. was reviewed on the Evaluation & Review Meeting for Scientific and Technological Achievements and evaluated to be internationally advanced on a whole, with key technology reaching the international leading level.
The expert panel for evaluation of achievements was headed by the Academician Wang Lijun and composed of seven experts including the academicians Lin Jun, Jiang Huilin, Jiang Fengyi, etc. The research fellow Zheng Xifeng, the Chairman of Cedar Electronics, serving as the person in charge of the project, made an overall report on the innovative application of scientific and technological achievements, technology advancement and IP advantages. The expert panel listened to and reviewed the evaluation report on scientific and technological achievements, research report, research technology report, economic benefit analysis report, novelty search report, and third-party test report of the achievements by online and offline means, and conducted site inspection.
Review Meeting for Scientific and Technological Achievements
Inspection on the Prototype during Review of Scientific and Technological Achievements
Data Examination during Review of Scientific and Technological Achievements
Production Line Inspection during Review of Scientific and Technological Achievements
Upon inquiry and discussion, the evaluation expert panel concluded that the materials under evaluation provided by the project team for the scientific and technological achievements were complete and complied with the requirements of scientific and technological achievement evaluation, and the project delivered a series of innovative achievements.
The Company invented the chip-level flip LED integrated encapsulation method, proposed the LED display hybrid stack gray scale enhancement drive control method; it also invented the LED screen composite display acquisition method, broke through the seamless splicing technology, conquered the technical problems of array module ultra-high precision design, ultra-high precision processing and complete machine vision seamless splicing, improved the surface vision consistency and complete machine reliability, and realized the highly bright and highly uniform display of ultra-high density LED products.
Breakthroughs were made in the full set of key technologies and processes for large-size and mini pixel pitch integrated encapsulation, uniformity control and the complete machine integration to form complete batch production technology and industrialized application technology, establish a supporting industry chain based on flip-chip LED integrated encapsulation and enable made-in-China and controllable core raw materials and components in the entire industry chain.
The Company took the lead in completing three series of products subject to super high density flip chip LED integrated encapsulation, including large screen, smart all-in-one and direct-display TV, and formed a series of independent intellectual property rights including patent, standard, trademark and monograph for the project.
The project was generally evaluated to be internationally advanced, in which the core technologies such as chip-level LED integrated encapsulation and pixel level composite acquisition were at the international advanced level.
The “Key Technology and Industrialization of Super High Density Flip Chip LED Integrated Encapsulation UHD Display” is a key special landmark achievement of the “13th Five-year Plan” national key research plan led and undertaken by Cedar Electronics, representing China’s outstanding accomplishments in scientific and technological innovation in the high-tech field during the “13th Five-year Plan” period, and has been selected for the “13th Five-year Plan” Scientific and Technological Achievement Exhibition; it was also selected for the State-of-art Technologies List of “Innovation China” in the field of electronic information, and won dozens of prizes such as the 22th China International Industry Fair Award; the Science and Technology Daily made a special report entitled the “Latecomer for Self-dependent Innovation in LED Display Industry”. Cedar’s independently developed products were successfully applied in major national projects such as Taiyuan Satellite Launch Center and Three Gorges Corporation, and sold to European and American countries. Cedar Electronics held the original core patents for the entire chain of COB display which provided strategic protection for the development of independent innovation of COB display, drove the synchronized and rapid development of upstream, midstream and downstream of LED industry chain in China so that the flip chip LED integrated encapsulation display industry became the prevailing trend in the industry.